VISS
Vertical Coating System

The VISS400 and VISS600 are modular platforms engineered for vertical coating processes, making them an ideal choice for scaling laboratory‑proven applications into full industrial production.

Both systems can be configured as a single‑end inline tool or as a through‑feed solution for continuous, high‑efficiency operation. Depending on the model, they support substrate widths of 400 mm or up to 600 mm. Substrates travel on a carrier system tilted seven degrees from vertical, enabling loading and unloading without touching the front surface.

This architecture allows cost‑effective coating of large substrates while maintaining a clean, particle‑free environment. Combined with vertical substrate transport, the VISS platforms are exceptionally well suited for semiconductor manufacturing—especially for advanced packaging, power electronics, and piezoelectric sensor applications.

Would you like to learn more? Explore the content below or contact us.

Scalable

through modular design

Easily adaptable to your requirements

through flexible configuration options

Loading without touching the substrate front side

due to carrier transport

VISS400

Compact dimensions and low weight enable use in confined production spaces

VISS600

High productivity thanks to substrate widths up to 600 mm

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13.10.2026 - 15.10.2026
Semicon West 2026

San Francisco, CA, USA

Moscone Center

North Hall | Booth 5373

18.11.2026 - 21.11.2026
Semicon Europe 2026

Munich, Germany

Exhibition Center

C2 / C2317

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