Advanced Packaging

Vacuum Deposition Equipment for Wafer or Panel-Level Substrates

Advanced semiconductor packaging integrates multiple chips into increasingly compact and efficient configurations to maximize system performance. As these architectures grow more complex, the demands on conductive and insulating layers rise accordingly. At the same time, substrates and area utilization must be optimized to maintain cost‑effective manufacturing.

The materials involved—and the deposition processes required—are becoming more sophisticated. High‑aspect‑ratio structures in particular require highly engineered platforms capable of addressing the most demanding metallization challenges.

This is where we excel: advancing materials and equipment innovation on both wafer and panel substrates, delivered with sub‑nanometer precision.