Advanced Packaging

Vacuum Deposition Equipment for Wafer or Panel-Level Substrates

There are many approaches to semiconductor advanced packaging, the art of efficiently and compactly connecting multiple chips to maximize system performance. 

Increasingly complex electrical systems are created by advanced packaging approaches. As a result, the requirements for the conductive and insulating layers are becoming more complex. At the same time, the substrates and the utilization of the available area must be optimized to manufacture these devices cost-effectively.

Materials, and the processes used to deposit them, are increasingly complex, demanding highly engineered platforms that can solve the most complex metallization challenges for high-aspect-ratio structures. And this is where we excel: materials and equipment innovation, on wafer or panel substrates, with sub-nanometer precision.